Technical details

Electronics

The electronics direction is structured as a continuous production flow where each operation supports the next stage with consistent quality and repeatability.

Capabilities9 domains

In this model, electronics assembly is treated as a connected sequence of operations where value comes from process coherence rather than isolated actions.

This approach supports flexible load balancing across stages while preserving steady throughput and consistent output quality over extended cycles.

Capabilities

SOLDER PASTE APPLICATION

We provide stable board preparation before the following assembly stages.

SMD COMPONENT ASSEMBLY

We perform dense and accurate placement with consistent installation quality.

SOLDER PASTE REFLOW / VAPOR PHASE SOLDERING

We establish reliable interconnects under controlled production dynamics.

WAVE SOLDERING OF THT COMPONENTS

We complete through-hole assembly stages with predictable output quality.

POST-SOLDER PCB CLEANING

We ensure clean finishing before inspection and verification cycles.

AUTOMATED OPTICAL INSPECTION

We maintain consistent assembly control with early deviation detection.

ELECTRONIC COMPONENT REPAIR

We perform corrective actions to recover module integrity and operability.

OPTIONAL X-RAY

We add deeper verification for hidden areas whenever enhanced inspection is required.

THERMOCOUPLE PRODUCTION OF ANY TYPE

We deliver sensing elements for a broad range of integration scenarios.